PayPay | Backend Engineer | Interview Experience | Sepetember 2026

Current
25 LPA base
4.3 YOE

OA
2 DSA questions.

Round 1 - Technical Fitment round
Some questions regarding my projects. Questions regarding kafka, paritions, backpressure etc. Some DB questions for isolation levels.
1 DSA problem - next greatest element in circular array.

Round 2 - HLD Round
Some 10 min project discussion. Design a coupon generation and application service. Some questions in the design like make it scalable, remove single point of faliures etc.

Round 3 - DSA Round
Only 1 DSA question - some problem regarding sweep line algorithm. The interviewer was wierd as I answered the problem in very less time. He then asked me to prove my solution for 15 min.
After that another problem to design a library to generate a random function. Then what monitoring parameters will you have in it. Then a basic LLD discussion for the design pattern for the library.
I had answered all the problems that they asked but I gave the DSA solution in CPP.

Verdict: I got a rejection mail after 1 week. I think because I answered DSA problem in CPP but they said I can write code in any language and I also know Java which they want.

Other Interview Experiences:
Tekion | PhonePe | NinjaVan | Incred | Sumo Logic

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